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覆铜板材料专业制造商
The professional manufacturer for CCL

制造公司
公司网站 浙江省杭州市余杭区余杭镇华一路2号
Address: 2# Huayi Road, Yuhang Town, Yuhang District, Hangzhou, Zhejiang
TEL: 86-0571-88650112 http://www.hzccl.com
FAX: 86-0571-88650120 PC: 311121
产品介绍

目录/Catalog

系列

类型

UL 型号

Tg(℃)

颜色

Td(℃)

T288(min)

CTE(%)

备注

页码

 

FR-4

H140A

135±5

黄/自然

310

2

4.3

可提供 Tg:140±5℃ 等各种 TG

3-5

CTI600(FR-4)

H1600A

135±5

黄/自然

310

1

4.5

 

8-9

无铅/有卤

FR-4

H140-1

135±5

≥325

≥5

≤4.0

 

10-12

H150(LF)

≥150

≥325

≥5

≤3.5

 

13-15

H1170

≥170

≥340

≥15

≤3.0

 

16-18

无卤

FR-4

H140H

135±5

黄/自然

≥325

≥5

≤4.0

可提供 CTI≥600 及苯并恶嗪改性高耐热无卤材料

19-21

H155H

150±5

≥325

≥5

≤4.0

22-24

附1. 覆铜板厚度公差表 / CCL thickness and tolerance list
附2:半固化片储存条件/ Prepreg Storage Condition


                        【H140A】
特性/ Features
  Tg:135±5℃ (DSC)
  可依需求提供多种Tg值/Different Tg available upon request Tg:140±5℃、Tg≥140℃
  UV Blocking与 AOI兼容可提高PCB生产效率
  UV Blocking and AOI compatible,so as to increase productivity efficiency
  可依需求提供仪表专用的FR-4板材/the meter appropriative FR-4 CCL upon request
  可依需求提供不具UV阻挡功能的自然色板材(白料)/No UV Blocking and natural color CCLupon request
应用领域/ Applications
  适合于2-6层PCB、计算机及外围设备、通讯设备、办公自动设备等。
  Suitable for medium multilayer printed circuit board, computer, communication equipment, OA equipment, etc.
  主要特性 / General properties

检测项目
Item

单位
Unit

检测条件
Test Condition

规范值
Spec

典型值
Typical Value

玻璃化转变温度 Tg

DSC

135±5

135.5

剥离强度 1oz Peel Strength

N/mm

288℃, 10S

≥1.40

1.81

热应力 Thermal stress

S

288℃,solder dip

> 10

120 s No delamination

弯曲强度 Flexural Strength

N/mm2

经向 LW

≥415

580

纬向 CW

≥345

485

燃烧性 Flammability

E 24/125

UL94V-0

V-0

表面电阻 Surface Resistivity

After moisture

≥1.0×104

5.16×107

体积电阻 VolumeResistivity

MΩ·cm

After moisture

≥1.0×106

5.07×108

介电常数 Dielectric Constant

1 MHZ C 24/23/50

≤5.4

4.8

介质损耗角正切 Loss Tangent

1 MHZ C 24/23/50

≤0.035

0.015

耐电弧 Arc Resistance

S

D48/50 + D0.5/23

≥60

125

击穿电压 Dielectric Breakdown

KV

D48/50 + D0.5/23

≥40

58

吸水率 Moisture Absorption

%

D24/23

≤0.8

0.15

热分解温度 Td

Weight Loss 5%

310

CTE Z-axis

Alpha 1

ppm / ℃

TMA

60

Alpha 2

ppm / ℃

300

50 - 260 ℃

%

4.3

T288

min

TMA

2

相比漏电起痕指数 CTI

V

IEC-60112

175 ~ 250

200

Specimen Thickness : 1.6mm ;
  Explanation: C: Humidity conditioning; D: Immersion conditioning in distilled water ;
         E: Temperature conditioning ;

◆ 介电常数 / Dielectric constant

◆ 热处理后板材经纬向尺寸变化
Dimensional change in cross and length direction after heat treatment

产品系列 / Purchasing information

厚度 Thickness

铜箔 Copper foil

标准尺寸 Standard size

0.10-3.2mm

12um-105um

37"×49" 、 41"×49" 、 43"×49"

※ Other sheet size and thickness could be available upon request

                 ◎ 半固化片介绍/Prepreg instruction
                     【H140AP (UV Prepreg)】

prepreg type

Resin Content(%)

Gel Time (sec/171℃) 胶化时间

Resin Flow 流动度

压合厚度 Cured thickness(mm/mil)

R/C(%)
含量

Tolerance
公差

Nominal

Range(±)mil

%

±

S

%

mm

mil

mm

mil

7628HRC

52

3

125 ± 20

30 ± 3

0.247

9.71

0.024

0.95

50

3

125 ± 20

29 ± 3

0.234

9.23

0.023

0.9

48

3

125 ± 20

28 ± 3

0.224

8.83

0.023

0.9

7628

45

3

130 ± 20

24 ± 3

0.207

8.15

0.020

0.8

43

3

130 ± 20

22 ± 3

0.197

7.76

0.020

0.8

1506

48

3

130 ± 20

29 ± 3

0.175

6.89

0.018

0.7

45

3

130 ± 20

28 ± 3

0.163

6.42

0.017

0.65

43

3

130 ± 20

25 ± 3

0.155

6.1

0.015

0.6

2116

58

3

120 ± 20

35 ± 3

0.145

5.71

0.015

0.6

57

3

120 ± 20

35 ± 3

0.142

5.59

0.014

0.55

55

3

120 ± 20

33 ± 3

0.134

5.28

0.014

0.55

53

3

120 ± 20

31 ± 3

0.127

5.00

0.013

0.5

50

3

120 ± 20

29 ± 3

0.119

4.69

0.013

0.5

1080

68

3

120 ± 20

44 ± 3

0.093

3.66

0.010

0.4

65

3

120 ± 20

42 ± 3

0.082

3.23

0.008

0.3

63

3

120 ± 20

39 ± 3

0.078

3.07

0.008

0.3

60

3

120 ± 20

37 ± 3

0.073

2.87

0.008

0.3

建议压制程式: Suggest cycle


                     【H1600A High CTI】
特性/ Features
  Tg:135±5℃ (DSC)
  优异的耐漏电起痕性,CTI≥600 / Excellent tracking resistance ,CTI ≥600
  UV Blocking与 AOI兼容/UV Blocking and AOI compatible
  优良的PCB加工性 / Good PCB processability
应用领域/ Applications
  电源基板、电视机、电冰箱、洗衣机等。
  Power base board、TV、refrigerator、 washing machine and etc.
主要特性 / General properties

检测项目
Item

单位
Unit

检测条件
Test Condition

规范值
Spec

典型值
Typical Value

玻璃化转变温度 Tg

DSC

135±5

135.2

剥离强度 1oz Peel Strength

N/mm

288℃, 10S

≥1.40

1.75

热应力 Thermal stress

S

288℃,solder dip

> 10

60 s No delamination

弯曲强度 Flexural Strength

N/mm2

经向 LW

≥415

577

纬向 CW

≥345

470

燃烧性 Flammability

E 24/125

UL94V-0

V-0

表面电阻 SurfaceResistivity

After moisture

≥1.0×104

5.12×107

体积电阻 Volume Resistivity

MΩ·cm

After moisture

≥1.0×106

5.25×108

介电常数 Dielectric Constant

1 MHZ C 24/23/50

≤5.4

4.6

介质损耗角正切 Loss Tangent

1 MHZ C 24/23/50

≤0.035

0.015

耐电弧 Arc Resistance

S

D48/50 + D0.5/23

≥60

120

击穿电压Dielectric Breakdown

KV

D48/50 + D0.5/23

≥40

57

吸水率 Moisture Absorption

%

D24/23

≤0.8

0.15

热分解温度 Td

Weight Loss 5%

310

CTE Z-axis

Alpha 1

ppm / ℃

TMA

60

Alpha 2

ppm / ℃

300

50 - 260 ℃

%

4.2

T288

min

TMA

1

相比漏电起痕指数 CTI

V

IEC-60112

≥600

600

  Specimen Thickness : 1.6mm ;
  Explanation: C: Humidity conditioning; D: Immersion conditioning in distilled water ;
         E: Temperature conditioning ;

◆ 介电常数 / Dielectric constant

◆ 热处理后板材经纬向尺寸变化
Dimensional change in cross and length direction after heat treatment

产品系列 / Purchasing information

厚度 Thickness

铜箔 Copper foil

标准尺寸 Standard size

0.63-3.2mm

12um-105um

37"×49" 、 41"×49" 、 43"×49"

※ Other sheet size and thickness could be available upon request

                 【H140-1 Lead-free Anti-CAF】
特性/ Features
  Tg:135±5℃ (DSC)
  UV Blocking与 AOI兼容可提高PCB生产效率
  UV Blocking and AOI compatible,so as to increase productivity efficiency
  优异的耐热性,Td ≥325℃,T288≥5min ,适合于无铅焊工艺;
  High thermal performance,Td ≥325℃ ,T288≥5min,suitable for lead-free process。
应用领域/ Applications
  适合于多层PCB、计算机及外围设备、通讯设备、办公自动设备、PCB无铅制程等。
  Suitable for medium multilayer printed circuit board, computer, communication equipment, OA equipment,
lead-free PCB process etc.
  主要特性 / General properties

检测项目
Item

单位
Unit

检测条件
Test Condition

规范值
Spec

典型值
Typical Value

玻璃化转变温度 Tg

DSC

135±5

136.5

剥离强度 1oz Peel Strength

N/mm

288℃, 10S

≥1.05

1.42

热应力 Thermal stress

S

288℃,solder dip

> 10

180 s No delamination

弯曲强度 Flexural Strength

N/mm2

经向 LW

≥415

580

纬向 CW

≥345

485

燃烧性 Flammability

E 24/125

UL94V-0

V-0

表面电阻 Surface Resistivity

After moisture

≥1.0×104

5.16×107

体积电阻 VolumeResistivity

MΩ·cm

After moisture

≥1.0×106

5.07×108

介电常数 Dielectric Constant

1 MHZ C 24/23/50

≤5.4

4.8

介质损耗角正切 Loss Tangent

1 MHZ C 24/23/50

≤0.035

0.017

耐电弧 Arc Resistance

S

D48/50 + D0.5/23

≥60

125

击穿电压 Dielectric Breakdown

KV

D48/50 + D0.5/23

≥40

58

吸水率 Moisture Absorption

%

D24/23

≤0.5

0.08

热分解温度 Td

Weight Loss 5%

≥ 325

340

CTE Z-axis

Alpha 1

ppm / ℃

TMA

≤60

46

Alpha 2

ppm / ℃

≤300

260

50 - 260 ℃

%

≤4.0

3.8

T288

min

TMA

≥ 5

30

相比漏电起痕指数 CTI

V

IEC-60112

175 ~ 250

200

  Specimen Thickness : 1.6mm ;
  Explanation: C: Humidity conditioning; D: Immersion conditioning in distilled water ;
         E: Temperature conditioning ;

◆ 热压力容器蒸煮测试 / PCT(High pressure cooker test )

PCT (E-120℃/ 105KPa)

Solder Dipping (288℃,10S)

Normal FR-4

H140-1

30min

OK

OK

60min

OK

OK

120min

NG

OK

H140-1 覆铜板耐CAF性能测试
  Test condition
  a) Laminate: t1.6mm H/H (#7628*8ply)
  b) Through hole wall to through hole wall distance:0.40
  c) Drill diameter: 0.3mm
  d) Condition: 85℃/85% RH 50V DC 1000h
  测试结果见图1,。
  The testing result as follows:  
      
              图1 改性FR-4(H140-1)覆铜板与普通FR-4覆铜板CAF测试图
  结果表明,改性FR-4(H140-1)覆铜板在耐CAF方面相比普通FR-4有显著提升。
  The result shows that improving FR-4(H140-1) has better anti-caf performance than normal FR-4
产品系列 / Purchasing informatio

厚度 Thickness

铜箔 Copper foil

标准尺寸 Standard size

0.10-3.2mm

12um-105um

37"×49" 、 41"×49" 、 43"×49"

※ Other sheet size and thickness could be available upon request

              ◎ 半固化片介绍/ Prepreg instruction
                  【H140-1 P (UV Prepreg)】

prepreg type

Resin Content(%)

Gel Time (sec/171℃) 胶化时间

Resin Flow
流动度

压合厚度 Cured thickness(mm/mil)

R/C(%)含量

Tolerance
公差

Nominal

Range(±)mil

%

±

S

%

mm

mil

mm

mil

7628HRC

52

3

100±20

30±3

0.227

8.91

0.023

0.90

50

3

100±20

29±3

0.214

8.43

0.022

0.85

48

3

100±20

28±3

0.206

8.11

0.020

0.8

7628

45

3

105±20

24±3

0.192

7.56

0.019

0.75

43

3

105±20

22±3

0.183

7.20

0.018

0.7

1506

48

3

105±20

29±3

0.162

6.38

0.017

0.65

45

3

105±20

28±3

0.151

5.94

0.015

0.6

43

3

105±20

25±3

0.145

5.71

0.015

0.6

2116

58

3

110±20

35±3

0.134

5.28

0.014

0.55

57

3

110±20

35±3

0.13

5.12

0.013

0.5

55

3

110±20

33±3

0.123

4.84

0.013

0.5

53

3

110±20

31±3

0.117

4.61

0.011

0.45

50

3

110±20

29±3

0.108

4.25

0.011

0.45

1080

68

3

110±20

44±3

0.084

3.31

0.008

0.3

65

3

110±20

42±3

0.076

2.99

0.008

0.3

63

3

110±20

39±3

0.071

2.80

0.008

0.3

60

3

110±20

37±3

0.065

2.56

0.008

0.3

建议压制程式: Suggest cycle


                   【H150(LF) Lead-free】
特性/ Features
  Tg≥150℃ (DSC)
  UV Blocking与 AOI兼容可提高PCB生产效率
  UV Blocking and AOI compatible,so as to increase productivity efficiency
  优异的耐热性,Td ≥325℃,T288≥5min ,适合于无铅焊工艺;
  High thermal performance,Td ≥325℃ ,T288≥5min,suitable for lead-free process。
应用领域/ Applications
  适合于多层PCB、计算机及外围设备、通讯设备、办公自动设备、PCB无铅制程等。
  Suitable for medium multilayer printed circuit board, computer, communication equipment, OA equipment,
lead-free PCB process etc.
主要特性 / General properties

检测项目
Item

单位
Unit

检测条件
Test Condition

规范值
Spec

典型值
Typical Value

玻璃化转变温度 Tg

DSC

≥ 150

154.5

剥离强度 1oz Peel Strength

N/mm

288℃, 10S

≥1.05

1.41

热应力 Thermal stress

S

288℃,solder dip

> 10

180s No delamination

弯曲强度 Flexural Strength

N/mm2

经向 LW

≥415

570

纬向 CW

≥345

465

燃烧性 Flammability

E 24/125

UL94V-0

V-0

表面电阻 Surface Resistivity

After moisture

≥1.0×104

6.12×107

体积电阻 VolumeResistivity

MΩ·cm

After moisture

≥1.0×104

6.25×108

介电常数 Dielectric Constant

1 MHZ C 24/23/50

≤5.4

4.7

介质损耗角正切 Loss Tangent

1 MHZ C 24/23/50

≤0.035

0.016

耐电弧 Arc Resistance

S

D48/50 + D0.5/23

≥60

125

击穿电压 Dielectric Breakdown

KV

D48/50 + D0.5/23

≥40

57

吸水率 Moisture Absorption

%

D24/23

≤0.5

0.10

热分解温度 Td

Weight Loss 5%

≥325

348

CTE Z-axis

Alpha 1

ppm / ℃

 

TMA

≤ 60

55

Alpha 2

ppm / ℃

≤ 300

276

50 - 260 ℃

%

≤ 3.5

3.3

T288

min

TMA

≥5

35

相比漏电起痕指数 CTI

V

IEC-60112

175 ~ 250

200

  Specimen Thickness : 1.6mm ;
  Explanation: C: Humidity conditioning; D: Immersion conditioning in distilled water ;
         E: Temperature conditioning ;

◆ 热压力容器蒸煮测试 / PCT(High pressure cooker test )

PCT (E-120℃/ 105KPa)

Solder Dipping (288℃,10S)

Normal FR-4

H150(LF)

30min

OK

OK

60min

OK

OK

120min

NG

OK

◆ 使用建议 / Suggestion for use
  1、使用前请进行烘板处理:150 ℃、2h 。
  Please baking the Laminate at 150 ℃、2 hours before using .
  2、由于层间结合力较常规FR-4差,钻孔加工时请注意。
  钻孔参数主要取决于孔的大小、内层厚度、层数、铜箔厚度和叠层厚度。
  以典型的0.4~1.0mm钻嘴孔径为例,其建议钻孔参数如下:
  钻刀转速:45~105 KRPM , 进刀速度: 50~150 IPM
  缩刀速度:500~1000 IPM, 建议使用次数:1500 HITS
  叠层高度:≤2pnls(2~6layers), 1pnl(≥8layers)
  覆层材料:0.2mm Aluminum
产品系列 / Purchasing informatio

厚度 Thickness

铜箔 Copper foil

标准尺寸 Standard size

0.10-3.2mm

12um-105um

37"×49" 、 41"×49" 、 43"×49"

※ Other sheet size and thickness could be available upon request


                  半固化片介绍/ Prepreg instruction
                   【H150 P(LF) (UV Prepreg)】

prepreg type

Resin Content(%)

Gel Time (sec/171℃) 胶化时间

Resin Flow
流动度

压合厚度 Cured thickness(mm/mil)

R/C(%)
含量

Tolerance 公差

Nominal

Range(±)mil

%

±

S

%

mm

mil

mm

mil

7628HRC

52

3

100±20

30±3

0.231

9.09

0.022

0.85

50

3

100±20

29±3

0.22

8.66

0.022

0.85

48

3

100±20

28±3

0.21

8.27

0.020

0.8

7628

45

3

105±20

24±3

0.195

7.68

0.019

0.75

43

3

105±20

22±3

0.186

7.32

0.018

0.7

1506

48

3

105±20

29±3

0.164

6.46

0.017

0.65

45

3

105±20

28±3

0.153

6.02

0.015

0.6

43

3

105±20

25±3

0.146

5.75

0.015

0.6

2116

58

3

105±20

35±3

0.136

5.35

0.014

0.55

57

3

105±20

35±3

0.132

5.20

0.013

0.5

55

3

105±20

33±3

0.125

4.92

0.013

0.5

53

3

105±20

31±3

0.119

4.69

0.011

0.45

50

3

105±20

29±3

0.11

4.33

0.011

0.45

1080

68

3

105±20

44±3

0.086

3.39

0.008

0.3

65

3

105±20

42±3

0.077

3.03

0.008

0.3

63

3

105±20

39±3

0.073

2.87

0.008

0.3

60

3

105±20

37±3

0.066

2.60

0.008

0.3

建议压制程式: Suggest cycle

                    【H1170 Lead-free】
特性/ Features
  Tg≥170℃ (DSC)
  UV Blocking与 AOI兼容可提高PCB生产效率
  UV Blocking and AOI compatible,so as to increase productivity efficiency
  优异的耐热性,Td ≥340℃,T288≥15min ,适合于无铅焊工艺;
  High thermal performance,Td ≥340℃ ,T288≥15min,suitable for lead-free process。
应用领域/ Applications
  适合于高多层PCB、计算机及外围设备、通讯设备、办公自动设备、PCB无铅制程等。
  Suitable for high-count layer PCB, computer, communication equipment, OA equipment,
  lead-free PCB process etc.
主要特性 / General properties

检测项目
Item

单位
Unit

检测条件
Test Condition

规范值
Spec

典型值
Typical Value

玻璃化转变温度 Tg

DSC

≥ 170

175.2

剥离强度 1oz Peel Strength

N/mm

288℃, 10S

≥1.05

1.41

热应力 Thermal stress

S

288℃,solder dip

≥10

180 s No delamination

弯曲强度 Flexural Strength

N/mm2

经向 LW

≥415

580

纬向 CW

≥345

482

燃烧性 Flammability

E 24/125

UL94V-0

V-0

表面电阻 Surface Resistivity

After moisture

≥1.0×104

2.52×107

体积电阻 VolumeResistivity

MΩ·cm

After moisture

≥1.0×104

3.21×108

介电常数 Dielectric Constant

1 MHZ C 24/23/50

≤5.4

4.7

介质损耗角正切 Loss Tangent

1 MHZ C 24/23/50

≤0.035

0.016

耐电弧 Arc Resistance

S

D48/50 + D0.5/23

≥60

122

击穿电压 Dielectric Breakdown

KV

D48/50 + D0.5/23

≥40

58

吸水率 Moisture Absorption

%

D24/23

≤0.5

0.10

热分解温度 Td

Weight Loss 5%

≥340

347

CTE Z-axis

Alpha 1

ppm / ℃

TMA

≤60

45

Alpha 2

ppm / ℃

≤300

270

50 - 260 ℃

%

≤3.0

2.9

T288

min

TMA

≥15

30

相比漏电起痕指数 CTI

V

IEC-60112

175 ~ 250

200

Specimen Thickness : 1.6mm ;
  Explanation: C: Humidity conditioning; D: Immersion conditioning in distilled water ;
         E: Temperature conditioning ;
  
                      【H1170 Lead-free】
◆优异的耐热性 / Excellent thermal stress resistance

产品系列 / Purchasing informati

厚度 Thickness

铜箔 Copper foil

标准尺寸 Standard size

0.10-3.2mm

12um-105um

37"×49" 、 41"×49" 、 43"×49"


                 半固化片介绍/ Prepreg instruction
                   【H1170 P (UV Prepreg)】

prepreg type

Resin Content(%)

Gel Time (sec/171℃)
胶化时间

Resin Flow
流动度

压合厚度 Cured thickness(mm/mil)

R/C(%)
含量

Tolerance
公差

Nominal

Range(±)mil

%

±

S

%

mm

mil

mm

mil

7628HRC

52

3

100±20

30±3

0.234

9.21

0.022

0.85

50

3

110±20

29±3

0.223

8.78

0.022

0.85

48

3

110±20

28±3

0.212

8.35

0.020

0.8

7628

45

3

115±20

24±3

0.197

7.76

0.019

0.75

43

3

115±20

22±3

0.188

7.40

0.018

0.7

1506

48

3

115±20

29±3

0.166

6.54

0.017

0.65

45

3

115±20

28±3

0.155

6.10

0.015

0.6

43

3

115±20

25±3

0.148

5.83

0.015

0.6

2116

58

3

115±20

35±3

0.138

5.43

0.014

0.55

57

3

115±20

35±3

0.136

5.35

0.013

0.5

55

3

115±20

33±3

0.127

5.00

0.013

0.5

53

3

115±20

31±3

0.12

4.72

0.011

0.45

50

3

115±20

29±3

0.111

4.37

0.011

0.45

1080

68

3

115±20

44±3

0.087

3.43

0.008

0.3

65

3

115±20

42±3

0.077

3.03

0.008

0.3

63

3

115±20

39±3

0.074

2.91

0.008

0.3

60

3

115±20

37±3

0.067

2.64

0.008

0.3

建议压制程式: Suggest cycle

                    【H140H Halogen-free】
特性/ Features
  无卤产品,Halogen-free product, Tg:135±5℃
  阻燃性达到UL94V-0 / Flammability UL 94V-0 .
  可依需求提供高CTI的无卤板材/ High CTI Halogen-free product available upon request (CTI 600)
应用领域/ Applications
  手机、电脑、通讯设备、仪器仪表、摄像机、电视机等。
  Mobile phone, Computer,Communication equipment , Instrumentation, VCR,Television, etc.
主要特性 / General properties

检测项目
Item

单位
Unit

检测条件
Test Condition

规范值
Spec

典型值
Typical Value

玻璃化转变温度 Tg

DSC

135±5

133

剥离强度 1oz Peel Strength

N/mm

288℃, 10S

≥1.05

1.42

热应力 Thermal stress

S

288℃,solder dip

> 10

180s No delamination

弯曲强度 Flexural Strength

N/mm2

经向 LW

≥415

580

纬向 CW

≥345

475

燃烧性 Flammability

E 24/125

UL94V-0

V-0

表面电阻 Surface Resistivity

After moisture

≥1.0×104

5.21×107

体积电阻 VolumeResistivity

MΩ·cm

After moisture

≥1.0×106

5.10×108

介电常数 Dielectric Constant

1 MHZ C 24/23/50

≤5.4

4.6

介质损耗角正切 Loss Tangent

1 MHZ C 24/23/50

≤0.035

0.015

耐电弧 Arc Resistance

S

D48/50 + D0.5/23

≥60

120

击穿电压 Dielectric Breakdown

KV

D48/50 + D0.5/23

≥40

57

吸水率 Moisture Absorption

%

D24/23

≤0.8

0.16

热分解温度 Td

Weight Loss 5%

≥325

358

T288 (不覆铜)

min

TMA

≥5

12

Z-CTE /50 - 260 ℃

%

TMA

≤4.0

3.9

相比漏电起痕指数 CTI

V

IEC-60112

175 ~ 250

200

卤素含量
Halogen content

Cl

ppm

EDX-GP

≤900

310

Br

ppm

≤900

30

Cl+Br

ppm

≤1500

350

  Specimen Thickness : 1.6mm ;
  Explanation: C: Humidity conditioning; D: Immersion conditioning in distilled water;
         E: Temperature conditioning ;

◆ 介电常数 / Dielectric constant

◆ 使用建议 / Suggestion for use
  1、使用前请进行烘板处理:150 ℃、2h 。
  Please baking the Laminate at 150 ℃、2 hours before using .
  2、由于层间结合力较常规FR-4差,钻孔加工时请注意。
  钻孔参数主要取决于孔的大小、内层厚度、层数、铜箔厚度和叠层厚度。
  以典型的0.4~1.0mm钻嘴孔径为例,其建议钻孔参数如下:
  钻刀转速:45~105 KRPM , 进刀速度: 50~150 IPM
  缩刀速度:500~1000 IPM, 建议使用次数:1500 HITS
  叠层高度:≤2pnls(2~6layers), 1pnl(≥8layers)
  覆层材料:0.2mm Aluminum
  Please pay attention to the machining for the interbedded energy is lower than the normal FR-4 .
  Drilling parameters are mainly dependent on hole size, layer thickness, layer number, copper thickness and
stack height. The following drilling parameters are for reference only. Typical drilling parameters for 0.4~1.0 mm drills are as follows:
  Spindle speed: 45~105 KRPM Feed rate: 50~150 IPM
  Retract rate: 500~1000 IPM sug. hit count: 1500 HITS
  Stack height: ≤2pnls(2~6layers), 1pnl(≥8layers) Entry Material: 0.2mm Aluminum

产品系列 / Purchasing informatio

厚度 Thickness

铜箔 Copper foil

标准尺寸 Standard size

0.10-3.2mm

12um-105um

37"×49" 、 41"×49" 、 43"×49"

※ Other sheet size and thickness could be available upon request

                半固化片介绍/ Prepreg instruction
                   【H140H P (UV Prepreg)】

prepreg type

Resin Content(%)

Gel Time (sec/171℃) 胶化时间

Resin Flow
流动度

压合厚度 Cured thickness(mm/mil)

R/C(%)
含量

Tolerance
公差

Nominal

Range(±)mil

%

±

S

%

mm

mil

mm

mil

7628HRC

52

3

130±20

30±3

0.227

8.93

0.023

0.90

50

3

135±20

29±3

0.217

8.41

0.022

0.85

48

3

135±20

28±3

0.206

8.11

0.020

0.8

7628

45

3

140±20

24±3

0.192

7.56

0.019

0.75

43

3

140±20

22±3

0.183

7.20

0.018

0.7

1506

48

3

140±20

29±3

0.162

6.38

0.017

0.65

45

3

140±20

28±3

0.151

5.94

0.015

0.6

43

3

140±20

25±3

0.145

5.71

0.015

0.6

2116

58

3

140±20

35±3

0.134

5.28

0.014

0.55

57

3

140±20

35±3

0.13

5.12

0.013

0.5

55

3

140±20

33±3

0.123

4.84

0.013

0.5

53

3

140±20

31±3

0.117

4.61

0.011

0.45

50

3

140±20

29±3

0.108

4.25

0.011

0.45

1080

68

3

140±20

44±3

0.084

3.31

0.008

0.3

65

3

140±20

42±3

0.076

2.99

0.008

0.3

63

3

140±20

39±3

0.071

2.80

0.008

0.3

60

3

140±20

37±3

0.065

2.56

0.008

0.3

建议压制程式: Suggest cycle

                     【H155H Halogen-free】
特性/ Features
  无卤产品,Halogen-free product, Tg:150±5℃℃
  阻燃性达到UL94V-0 / Flammability UL 94V-0 .
  可依需求提供高CTI的无卤板材/ High CTI Halogen-free product available upon request (CTI 600)
应用领域/ Applications
  手机、电脑、通讯设备、仪器仪表、摄像机、电视机等。
  Mobile phone, Computer,Communication equipment , Instrumentation, VCR,Television, etc.
主要特性 / General properties

检测项目
Item

单位
Unit

检测条件
Test Condition

规范值
Spec

典型值
Typical Value

玻璃化转变温度 Tg

DSC

150±5 ℃

150.2

剥离强度 1oz Peel Strength

N/mm

288℃, 10S

≥1.05

1.42

热应力 Thermal stress

S

288℃,solder dip

> 10

180 s No delamination

弯曲强度 Flexural Strength

N/mm2

经向 LW

≥415

580

纬向 CW

≥345

475

燃烧性 Flammability

E 24/125

UL94V-1

V-0

表面电阻 Surface Resistivity

After moisture

≥1.0×104

5.21×107

体积电阻 VolumeResistivity

MΩ·cm

After moisture

≥1.0×106

5.10×108

介电常数 Dielectric Constant

1 MHZ C 24/23/50

≤5.4

4.6

介质损耗角正切 Loss Tangent

1 MHZ C 24/23/50

≤0.035

0.015

耐电弧 Arc Resistance

S

D48/50 + D0.5/23

≥60

120

击穿电压 Dielectric Breakdown

KV

D48/50 + D0.5/23

≥40

57

吸水率 Moisture Absorption

%

D24/23

≤0.8

0.16

热分解温度 Td

Weight Loss 5%

≥325

358

T288 (不覆铜)

min

TMA

≥5

30

Z-CTE /50 - 260 ℃

%

TMA

≤4.0

3.5

相比漏电起痕指数 CTI

V

IEC-60112

175 ~ 250

200

卤素含量
Halogen content

Cl

ppm

EDX-GP

≤900

310

Br

ppm

≤900

30

Cl+Br

ppm

≤1500

350

  Specimen Thickness : 1.6mm ;
  Explanation: C: Humidity conditioning; D: Immersion conditioning in distilled water;
         E: Temperature conditioning ;

◆ 介电常数 / Dielectric constant

◆ 使用建议 / Suggestion for use
  1、使用前请进行烘板处理:150 ℃、2h 。
  Please baking the Laminate at 150 ℃、2 hours before using .
   2、由于层间结合力较常规FR-4差,钻孔加工时请注意。
  钻孔参数主要取决于孔的大小、内层厚度、层数、铜箔厚度和叠层厚度。
  以典型的0.4~1.0mm钻嘴孔径为例,其建议钻孔参数如下:
  钻刀转速:45~105 KRPM , 进刀速度: 50~150 IPM
  缩刀速度:500~1000 IPM, 建议使用次数:1500 HITS
  叠层高度:≤2pnls(2~6layers), 1pnl(≥8layers)
  覆层材料:0.2mm Aluminum
   Please pay attention to the machining for the interbedded energy is lower than the normal FR-4 .
  Drilling parameters are mainly dependent on hole size, layer thickness, layer number, copper thickness and
stack height. The following drilling parameters are for reference only. Typical drilling parameters for 0.4~1.0 mm drills are as follows:
  Spindle speed: 45~105 KRPM Feed rate: 50~150 IPM
  Retract rate: 500~1000 IPM sug. hit count: 1500 HITS
  Stack height: ≤2pnls(2~6layers), 1pnl(≥8layers) Entry Material: 0.2mm Aluminum

产品系列 / Purchasing informatio

厚度 Thickness

铜箔 Copper foil

标准尺寸 Standard size

0.10-3.2mm

12um-105um

37"×49" 、 41"×49" 、 43"×49"

※ Other sheet size and thickness could be available upon request

               半固化片介绍/ Prepreg instruction
                   【H155H P (UV Prepreg)】

prepreg type

Resin Content(%)

Gel Time (sec/171℃) 胶化时间

Resin Flow 流动度

压合厚度 Cured thickness(mm/mil)

R/C(%)
含量

Tolerance
公差

Nominal

Range(±)mil

%

±

S

%

mm

mil

mm

mil

7628HRC

52

3

105±20

30±3

0.227

8.93

0.023

0.90

50

3

105±20

29±3

0.217

8.41

0.022

0.85

48

3

110±20

28±3

0.206

8.11

0.020

0.8

7628

45

3

110±20

24±3

0.192

7.56

0.019

0.75

43

3

110±20

22±3

0.183

7.20

0.018

0.7

1506

48

3

110±20

29±3

0.162

6.38

0.017

0.65

45

3

110±20

28±3

0.151

5.94

0.015

0.6

43

3

110±20

25±3

0.145

5.71

0.015

0.6

2116

58

3

110±20

35±3

0.134

5.28

0.014

0.55

57

3

110±20

35±3

0.13

5.12

0.013

0.5

55

3

110±20

33±3

0.123

4.84

0.013

0.5

53

3

110±20

31±3

0.117

4.61

0.011

0.45

50

3

110±20

29±3

0.108

4.25

0.011

0.45

1080

68

3

110±20

44±3

0.084

3.31

0.008

0.3

65

3

110±20

42±3

0.076

2.99

0.008

0.3

63

3

110±20

39±3

0.071

2.80

0.008

0.3

60

3

110±20

37±3

0.065

2.56

0.008

0.3

建议压制程式: Suggest cycle

          覆铜板厚度公差表CCL thickness and tolerance list

标准厚度 mm
standard thickness

厚度公差 mm / tolerance

Class B/L 级

Class C/M 级

0.025 ~ 0.119

±0.018

±0.013

0.120 ~ 0.164

±0.025

±0.018

0.165 ~ 0.299

±0.038

±0.025

0.300 ~ 0.499

±0.050

±0.038

0.500 ~ 0.785

±0.064

±0.050

0.786 ~ 1.039

±0.100

±0.075

1.040 ~ 1.674

±0.130

±0.075

1.675 ~ 2.564

±0.180

±0.100

2.565 ~ 3.579

±0.230

±0.130

3.580 ~ 6.350

±0.300

±0.150

  ※ 一般情况下,华正电子依照二级厚度公差(B/L级)要求接单作业,加严厚度公差(三级公差C/M级)或特殊厚度公差要求可协商解决。
  Commonly , we will accept the order form according to the Class B/L , the Class C/M or other special tolerance could be available upon request.
  ※ Class B、C表示不含铜箔的板材厚度; Class L、M为含铜箔在内的板材厚度;
  Class B、C figure the dielectric thickness ;Class L、M figure the overall thickness;
  如下图 / As follows:


           半固化片储存条件:Prepreg Storage Condition
  温度≤20℃、湿度≤50%,保存时间3个月;温度≤5℃、密封条件下,保存时间6个月.
  T≤20℃& ≤50%RH,Within 3 months; T≤5 ℃ Within 6 months (seal condition).
  在上述要求内,我司可立即安排PP送样;若有特殊要求,由供需双方商定。Follow upwards condition,Our company will arrange sample immediately. We can negotiation if you have special requirement.

 

 

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